High-Adhesion Resin (Ester-Soluble) E1206 Provides excellent adhesion enhancement on PP and PP/EPDM substrates
A newly developed adhesion promoter for PP substrates, exhibiting excellent adhesion to various PP substrates. The solution demonstrates outstanding low-temperature stability: highly compatible and can be directly added to coating systems. Provides superior adhesion enhancement effects on PP and PP/EPDM substrates. Excellent compatibility allows direct incorporation into acrylic, alkyd, and other coatings. It exhibits strong interlayer adhesion with overcoat coatings, such as polyester/melamine
Appearance: | Slightly yellow transparent granular |
Viscosity: | CPS at 25°C 200–600 (dissolved in ethyl acetate to form20% solids solution) |
Chlorine content: | 25–30% |
Solution: | 30% solution |
Softening temperature: | Approximately 70°C |
Dry film state: | Colorless, transparent, flexible, thermoplastic resin |
Solid state: | Slightly yellow granular lumps |
- Parameters
Appearance: | Slightly yellow transparent granular |
Viscosity: | CPS at 25°C 200–600 (dissolved in ethyl acetate to form20% solids solution) |
Chlorine content: | 25–30% |
Solution: | 30% solution |
Softening temperature: | Approximately 70°C |
Dry film state: | Colorless, transparent, flexible, thermoplastic resin |
Solid state: | Slightly yellow granular lumps |
Description
A newly developed adhesion promoter for PP substrates, exhibiting excellent adhesion to various PP substrates. The solution demonstrates outstanding low-temperature stability: highly compatible and can be directly added to coating systems. Provides superior adhesion enhancement effects on PP and PP/EPDM substrates. Excellent compatibility allows direct incorporation into acrylic, alkyd, and other coatings. It exhibits strong interlayer adhesion with overcoat coatings, such as polyester/melamine baked paints and polyurethane systems. The solution demonstrates excellent low-temperature stability (30% toluene solution at 5°C). It is slightly soluble in 1,6-hexanediol diacrylate and can be applied in UV-curable systems.
Specification
Appearance: | Slightly yellow transparent granular |
Viscosity: | CPS at 25°C 200–600 (dissolved in ethyl acetate to form20% solids solution) |
Chlorine content: | 25–30% |
Solution: | 30% solution |
Softening temperature: | Approximately 70°C |
Dry film state: | Colorless, transparent, flexible, thermoplastic resin |
Solid state: | Slightly yellow granular lumps |
Features
Features excellent adhesion, compatibility, and stability. Used in color primers for polyolefin substrates without requiring pretreatment such as corona discharge, flame treatment, or solvent cleaning. Applications include automotive, toys, PP adhesives, construction, marine and protective coatings, inks and packaging, automotive refinish, and safety protection.
Delivers outstanding adhesion enhancement on PP and PP/EPDM substrates.
Excellent compatibility allows direct addition to acrylic/alkyd coatings.
Exhibits strong interlayer adhesion with topcoats such as polyester/melamine baked finishes and polyurethane systems.
Typically dissolved in xylene. For environmental requirements (benzene-free), use MCH/EA or MEK mixed solvent (1:1 ratio). Specific formulations should be determined through customer testing.
Application
1. Plastic composite adhesive.
2. Gravure plastic composite ink adhesive.
3. Adhesive for PP, PET, ABS, and PVC applications.
4. Heat-resistant ink adhesive.
5. Anti-corrosion coating adhesive.
Package
20 kg per bag
Model Chlorine Content (%) Appearance Viscosity (mPa·s) Viscosity Measurement Conditions (25°C) Primary Applications
13-LLP 26 Solid Particles 2000-10000 30% Solution For Coatings
13-LP 26 Solid Particles 20-80 10% Solution For Coatings
15-LP 30 Solid Particles 1500-3000 30% Solution For Inks
16-LP 32 Solid Particles 200-1000 20% Solution For Inks
14-LWP 27 Solid Particles 10-50 15% Solution Coatings
CY-9122P 22 Solid Particles 20-100 20% Solution Primer for PP Molded Products
CY-9124P 24.5 Solid Particles 15-100 20% Solution Primer for PP Molded Products
HM-21P 21 Solid particles 10-100 20% solution Primer for PP molded products
DX-526P 26 Solid particles 200-500 30% solution Coating
DX-530P 30 Solid particles 200-500 30% solution Ink
REMARK |
The above information is believed to be accurate and presents the best explanation currently available to us. We assume no liability resulting from above content. The technical standards are formulated and revised by customers’ requirement and us, if there are any changes, the latest specification will be executed and confirmed in the contract. |
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High-Adhesion Resin (Ester-Soluble) E1206 Provides excellent adhesion enhancement on PP and PP/EPDM substrates
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