Waterborne Epoxy Resin 128 F0721 Excellent adhesion Building Adhesion and Repair
Waterborne Epoxy Resin 128 is a water-dispersed epoxy resin emulsion produced through specialized modification processes. Using water as the dispersion medium, it features extremely low VOC content, is environmentally friendly and non-toxic, ensuring safe and convenient application. Upon reaction with the compatible waterborne curing agent, it forms a coating film exhibiting excellent adhesion, chemical resistance, hardness, and abrasion resistance.
Water-Based Polyamide Emulsion JT-630 E1120 Good Water Resistance Emulsion Polymerization Method
Water-based polyamide emulsion is a water-based system composed of polyamide, water-soluble polymers, and water. It offers environmental benefits such as non-flammability, non-toxicity, and pollution-free properties. In recent years, it has gradually replaced organic solvent-based polyamides, becoming a key development direction in this field.
Polyamide Resin 611DK (Alcohol-Soluble) E1115 Superior Chemical Resistance Exhibits strong resistance to acids
Polyamide Resin 611DK (Alcohol-Soluble) is an ethanol-soluble polyamide suitable for photogravure inks and aniline printing inks. 611DK exhibits excellent chelating stability; its use with chelating agents enhances heat resistance and other properties. Additionally, when used with inorganic pigments, it delivers ideal color development and gloss. 611DK exhibits excellent compatibility with nitrocellulose, and its combined use enhances the gloss and heat resistance of nitrocellulose.
Alcohol-Soluble Polyamide Resin 640L-2 E1114 low-temperature stabilit good gloss
SUNMIDE 640L-2 is an alcohol-soluble polyamide resin, a low-viscosity variant of SUNMIDE 640, suitable for flexographic printing inks. It exhibits excellent low-temperature stability.
Colorless Transparent Dammar Resin E1011 Excellent film-forming properties Dissolves in organic solvents
Colorless Transparent Dammar Resin is a natural resin extracted from Dipterocarpaceae plants and refined through specialized processes. Featuring a pure chemical structure, it exhibits a crystal-clear, colorless transparent appearance. This resin serves as a vital raw material widely utilized across multiple industries including coatings, inks, adhesives, and handicrafts. The primary constituents of dammar resin are resin acids and terpenoid compounds, which confer its distinctive physicochemica
Exquisite Dama resin E1006 Solvent releases quickly delivering excellent surface results Ink products utilizing this resin
Alcohol-refined Dama resin is a tackifying resin specially used in printing inks. Soluble in benzene, ester, alcohol and ester,
After dissolving, it is stable without precipitation floc. The ink products using this resin have fast solvent release and good surface effect, and they have good adhesion to polymer materials such as PE, PP, PU, etc.
Exquisite Dama resin E1005 For composite inks and surface printing inks used to enhance adhesion and flow properties
Alcohol-refined Dama resin is a tackifying resin specially used in printing inks. Soluble in benzene, ester, alcohol and ester,
After dissolving, it is stable without precipitation floc. The ink products using this resin have fast solvent release and good surface effect, and they have good adhesion to polymer materials such as PE, PP, PU, etc.
Epoxy Resin BE-188EL E0475 high mechanical properties electrical equipment
Epoxy Resin BE-188EL is a high-purity, high-transparency liquid base epoxy resin produced by reacting bisphenol A with epichlorohydrin. It is widely used in electronics, coatings, adhesives, composite materials, and other industries.
Bisphenol F Epoxy Resin NPEF-170 E0454 Low viscosity Easy to process and mix Suitable for spraying
NPEF-170 is a low-viscosity, high-reactivity bisphenol F epoxy resin featuring outstanding chemical resistance, mechanical strength, and curing performance. Compared to traditional bisphenol A epoxy resins, NPEF-170 exhibits lower viscosity and higher crosslink density, making it suitable for high-performance coatings, composites, adhesives, and electronic encapsulation applications.
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