Adhesion Resin (EPDM-Based) E1204 Electronics and Electrical Appliances Bonding and encapsulation of EPDM sealing rings and shock-absorbing pads
Adhesion-enhancing resin (EPDM substrate) undergoes chemical modification to incorporate groups with excellent compatibility with EPDM molecular segments and highly reactive polar functional groups. This enables effective wetting and penetration into the EPDM substrate surface, forming a robust anchoring layer that significantly improves the adhesion and bonding durability of various adhesives, coatings, and inks on its surface.
Item Specification
Appearance: Light yellow to white granules
Chlorine Content: 28-32 wt%
Viscosity (25°C, 20% toluene solution): 30-60 mPa·s
Softening Point: 130-150°C
Solubility: Completely soluble in toluene, ethyl acetate, methyl ethyl ketone, etc.
Solid Content: 15±2%
- Parameters
Item Specification
Appearance: Light yellow to white granules
Chlorine Content: 28-32 wt%
Viscosity (25°C, 20% toluene solution): 30-60 mPa·s
Softening Point: 130-150°C
Solubility: Completely soluble in toluene, ethyl acetate, methyl ethyl ketone, etc.
Solid Content: 15±2%
Description
Adhesion-enhancing resin (EPDM substrate) undergoes chemical modification to incorporate groups with excellent compatibility with EPDM molecular segments and highly reactive polar functional groups. This enables effective wetting and penetration into the EPDM substrate surface, forming a robust anchoring layer that significantly improves the adhesion and bonding durability of various adhesives, coatings, and inks on its surface.
Specification
Item Specification
Appearance: Light yellow to white granules
Chlorine Content: 28-32 wt%
Viscosity (25°C, 20% toluene solution): 30-60 mPa·s
Softening Point: 130-150°C
Solubility: Completely soluble in toluene, ethyl acetate, methyl ethyl ketone, etc.
Solid Content: 15±2%
III. Product Features:
Highly Targeted: Specifically designed for difficult-to-bond polyolefin elastomers like EPDM, addressing industry pain points where conventional adhesives fail to bond or provide weak adhesion.
Suitable for Primer/Built-in Applications:
As a primer: Apply a layer on EPDM substrates to form an active transition layer, significantly enhancing the bonding strength of subsequent adhesives.
As an Internal Additive: Can be directly blended into adhesive or coating formulations (compatibility testing required) to function as an adhesion-promoting component.
Exceptional Bond Strength: Significantly enhances failure-to-substrate bond strength with various adhesives including polyurethane (PU), epoxy, and silicone.
Environmental Aging Resistance: The bonded layer exhibits outstanding heat resistance, resistance to humid heat aging, and chemical resistance (e.g., oil resistance, coolant resistance), meeting demanding industrial environment requirements.
Easy Application: Single-component system requiring no complex mixing; applicable via brush coating, spray coating, dip coating, and other methods.
IV. Applications:
Automotive Industry: Bonding EPDM seals (doors, windows, trunks) to body panels and glass; assembling EPDM water channels, bellows, and other components.
Rail Transportation: Bonding and installing EPDM seals for high-speed trains and subway vehicles.
Construction & Building Materials: Overlapping bonding of EPDM waterproof membranes; bonding and fixing EPDM rubber gaskets to concrete and metal.
Electronics & Appliances: Bonding and encapsulation of EPDM sealing rings and vibration damping pads.
V. Product Packaging:
25KG/bag. Store sealed in a cool, dry, well-ventilated area away from direct sunlight, heat sources, and open flames. Recommended storage temperature: 5°C - 35°C.
REMARK |
The above information is believed to be accurate and presents the best explanation currently available to us. We assume no liability resulting from above content. The technical standards are formulated and revised by customers’ requirement and us, if there are any changes, the latest specification will be executed and confirmed in the contract. |
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Adhesion Resin (EPDM-Based) E1204 Electronics and Electrical Appliances Bonding and encapsulation of EPDM sealing rings and shock-absorbing pads
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