Gemstone Adhesive H0629 ootwear materials resin diamonds igh compressive strength
Suitable for encapsulating gemstone beads in buttons, footwear materials, resin diamonds, and gemstones. Multiple grades and specifications are available to accommodate different usage scenarios.
I. Product Application:
Suitable for encapsulating gemstone beads in buttons, footwear materials, resin diamonds, and gemstones. Multiple grades and specifications are available to accommodate different usage scenarios.
II. Product Advantages:
This gem adhesive features low viscosity and colorless transparency. After polishing, the cured surface exhibits no bubbles or pores, presenting a smooth, wrinkle-free finish with no peeling. Upon full curing, it achieves a hardness exceeding 95D and demonstrates long-term resistance to yellowing. It offers excellent acid and alkali resistance, withstands humid heat and atmospheric aging, and possesses superior physical properties including high compressive strength, scratch resistance, wear resistance, and durability.
Specification
Shenzhen jitian Chemical Co., Ltd. - Gem Adhesive | ||
Name | Gem Adhesive | |
Packaging | 4 kg/set 20 kg/box | |
Model | H0629-A | H0629-B |
Color | Colorless transparent liquid | Colorless transparent liquid |
Mix Ratio | 3：1 | |
Viscosity CPS | 8000 | 160 |
Hardness | 85 SHORED | |
Shelf Life | Store separately, 12 months | |
Working Time | Working time for 100 grams at room temperature (25°C) is 25-30 minutes | |
Curing Time | Cures in 8-12 hours after mixing 100 grams of grinding compound at room temperature (25°C). | |
Note: The above data is provided for reference only. Actual results may vary based on individual experimental data. | ||
Operating Procedure:
1. Cleaning: Before use, sand the surface of the object to be bonded smooth and ensure it is thoroughly clean.
2. Mixing: Maintain precise proportions. The mixing ratio for this product is 3:1 by weight, i.e., 30 grams of Component A to 10 grams of Component B. Stir thoroughly before use. For optimal results, vacuum degassing is recommended prior to application.
3. Application: Epoxy products cure effectively at room temperature. Accelerated curing occurs at 30-80°C (86-176°F). Higher temperatures increase curing speed and final strength.
4. Molding: After applying adhesive, secure bonded parts with clamps until fully cured before use.
REMARK |
The above information is believed to be accurate and presents the best explanation currently available to us. We assume no liability resulting from above content. The technical standards are formulated and revised by customers’ requirement and us, if there are any changes, the latest specification will be executed and confirmed in the contract. |
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